- 经验
- 任何
- 薪水
- SGD 14,000 / month
- 职位空缺
- 1
- 发布
- 11 小时前
- 工作模式
- 在办公室
- 学历
- Degree and above
- 恢复
- 需要申请
你的工作地点
职位描述
Job Overview
We are seeking an experienced R&D Manager to oversee and lead research and development projects focused on die bonding and wire bonding machinery and equipment. This role demands staying updated with cutting-edge technologies and industry trends while fostering team development and growth.
Key Responsibilities
- Direct and manage R&D initiatives related to die bonding and wire bonding machines and equipment.
- Continuously monitor and evaluate the latest technology and trends within the industry.
- Provide leadership and mentorship to the team to facilitate professional growth and operational excellence.
Candidate Requirements
- Proven work experience with die bonding or wire bonding technology.
- Proficiency in SOLIDWORKS or other CAD design software.
- A bachelor's degree or higher qualification in a relevant field.
Additional Information
Only candidates who are shortlisted will be contacted with further details.