Senior Thin Film Scientist – Eindhoven

Role overview

This role sits inside an early-stage deep-tech startup developing a new deposition platform for semiconductor thin films. The focus is to translate the platform’s technical capabilities into a clear product-market fit by matching the technology to present and future semiconductor applications.

You will determine which materials, film types, and use cases are the best strategic fit for the platform’s constraints. In parallel, you will set up the characterization workflow needed to qualify films for pilot lines and fab environments.

Working closely with the CTO, mechanical engineers, and plasma process engineers, you will use materials science expertise to connect deposited film properties with process and plasma conditions, helping shape key system architecture decisions.

This is a startup setting with fast-moving priorities, limited structure, and frequent iteration. The role calls for comfort with ambiguity, short timelines, and broad ownership of product-defining decisions.

Work arrangement and location

The position is based in Eindhoven at High Tech Campus. The working model is 4 days on-site and 1 day hybrid.

Visa and equity

Visa sponsorship is available. ESOP participation is available and will be discussed individually.

Responsibilities

• Translate the core thin-film deposition platform into practical semiconductor applications.
• Lead the roadmap for thin-film development across current advanced semiconductor use cases.
• Assess the main bottlenecks in the semiconductor industry and identify the materials improvements likely to be needed over the next 5 to 7 years.
• Set the critical material metrics for each film, including composition, density, stress, uniformity, defect levels, electrical behavior, and thermal performance.
• Own the end-to-end thin-film characterization flow: choose the right metrology, plan experiments, analyze findings, and turn results into process guidance.
• Coordinate external metrology partners and progressively build internal measurement capability, including ellipsometry, AFM, XPS, XRR, XRD, SEM, TEM, TOF-SIMS, electrical testing, and thermal testing.
• Work with the plasma process engineers and CTO to connect plasma settings with the resulting film properties.
• Support the company’s intellectual property direction related to materials and deposition methods.

Requirements

• Extensive experience in the semiconductor industry, specifically with thin films, materials, or production processes used in real chip manufacturing.
• Strong command of thin-film behavior, including nucleation and growth, microstructure, stress, defects, stoichiometry, and the influence of deposition conditions.
• Demonstrated success in creating new materials or improving existing ones for actual semiconductor manufacturing settings.
• Solid understanding of current semiconductor stacks and market direction, with a practical industry perspective rather than a purely academic one.
• Awareness of where semiconductor innovation is heading over the next 5 to 7 years.
• Working knowledge of deposition technologies such as PVD, CVD, ALD, PLD, or ion-beam systems.
• Practical experience with thin-film characterization methods such as ellipsometry, AFM, XPS, XRR, XRD, SEM, TEM, TOF-SIMS, electrical testing, and thermal testing.
• Experience using multivariable DOE and statistical methods to analyze process data.
• Strong self-direction and senior-level judgment, with the ability to act independently.
• Fluency in English.

Additional requirements

• A PhD in materials science, applied physics, chemistry, or a closely related discipline.
• Alternatively, an MSc plus at least 10 years of relevant industry experience in semiconductor manufacturing.

Preferred experience

• Exposure to low-k dielectrics or advanced metals for next-generation interconnects.
• Hands-on familiarity with PVD, CVD, ALD, PLD, or ion-beam deposition equipment and techniques.

Benefits

• Relocation support for moving to Eindhoven, within reasonable limits.