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New Product Introduction Project Manager - Wafer Level Packaging

STATS ChipPAC

Singapore · Full Time

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Experience
Any
Salary
Openings
1
Posted
2 hours ago
Work mode
In office
Eligibility
Only Singaporean citizens and Permanent Residents are eligible to apply.
Resume
Required to apply

Where you'll work

Job description

Overview

Seeking a highly organized, flexible, and motivated NPI Engineer or Senior NPI Engineer to lead customer qualification efforts for cutting-edge Wafer Level Packaging products, including both Fan-In and Fan-Out packages. This role centers on project and program management with a focus on new product introductions.

Role Responsibilities

  • Act as the principal coordinator for new WLP products, overseeing their journey from initial development through qualification to mass production launch.
  • Collaborate directly with external customers, process engineering teams, operations personnel, and various support functions to ensure qualification milestones are met efficiently and on schedule.
  • Own and maintain the qualification roadmap, manage all customer communications, monitor critical deliverables, and proactively address potential risks.

Candidate Requirements

  • Open to recent graduates eager to develop their careers in this field.
  • Applicants must be Singaporean citizens or permanent residents.

Work styles they’re looking for

Communication Adaptability Cross-functional Collaboration Proactiveness

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