New Product Introduction Engineer

Position Overview

The New Product Introduction (NPI) Engineer will oversee activities related to launching new products and ensuring a seamless transition from development stages to high-volume manufacturing within semiconductor operations. This role requires close collaboration with diverse teams to establish, validate, and improve manufacturing workflows encompassing lithography, wet processing, die preparation, pick-and-place (PnP), reconstitution (recon), molding, and other backend procedures.

Key Responsibilities

• Lead and assist NPI builds progressing from prototype, through engineering and qualification phases, up to mass production.
• Manage process setup, prepare lines, and qualify materials for newly introduced products.
• Work alongside Research & Development, Product Engineering, and Quality Assurance teams to confirm manufacturability and enhance process stability.
• Create and assess process flows, work instructions, FMEAs, and control plans tailored for new products.
• Coordinate engineering builds, keep track of advancement, and troubleshoot technical challenges during NPI stages.
• Address customer demands, facilitate audits, and manage documentation necessary for product qualifications.
• Provide technical support for backend manufacturing processes.
• Identify and solve issues related to process deviations, yields, and equipment malfunctions.
• Analyze process information including Statistical Process Control (SPC) data and apply corrective and preventive measures.
• Champion continuous improvement projects aimed at raising yield, quality, and reducing cycle time.
• Collaborate with Equipment, Quality, Production, and Supply Chain departments to maintain smooth operations.
• Liaise with suppliers and vendors for validating materials and equipment.
• Engage in design review sessions, offering feedback on Design for Manufacturability (DFM).
• Ensure thorough documentation of all process specifications, changes, and qualifications.
• Maintain compliance with internal and customer standards, as well as industry regulations.
• Support various audits including internal, customer, and certification reviews.

Qualifications and Experience

• Bachelor’s Degree in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or related disciplines.
• Minimum of five years’ semiconductor manufacturing experience, with a preference for backend or advanced packaging exposure.
• Prior experience in new product introduction, process development, or managing high-mix manufacturing is advantageous.
• Strong familiarity with semiconductor process stages such as lithography, wet processes, die preparation, PnP, reconstitution, and molding.
• Proficient in problem-solving approaches including root cause analysis tools like 8D, Fishbone diagrams, and FMEA techniques.
• Experience utilizing SPC, Design of Experiments (DOE), and other data analysis tools is preferred.
• Excellent communication skills and capability to manage multiple stakeholders effectively.
• Able to operate efficiently in a dynamic, high-volume manufacturing setting.
• Knowledge of advanced packaging methods, including fan-out and wafer-level packaging technologies.
• Hands-on familiarity with automation and Manufacturing Execution Systems (MES).
• Six Sigma or Lean certifications would be considered an asset.