- 経験
- どれでも
- 給料
- SGD 14,000 / month
- 求人情報
- 1
- 投稿済み
- 11時間前
- 作業モード
- 在任中
- 教育
- Degree and above
- 再開する
- 応募必須
勤務地
仕事内容
Job Overview
We are seeking an experienced R&D Manager to oversee and lead research and development projects focused on die bonding and wire bonding machinery and equipment. This role demands staying updated with cutting-edge technologies and industry trends while fostering team development and growth.
Key Responsibilities
- Direct and manage R&D initiatives related to die bonding and wire bonding machines and equipment.
- Continuously monitor and evaluate the latest technology and trends within the industry.
- Provide leadership and mentorship to the team to facilitate professional growth and operational excellence.
Candidate Requirements
- Proven work experience with die bonding or wire bonding technology.
- Proficiency in SOLIDWORKS or other CAD design software.
- A bachelor's degree or higher qualification in a relevant field.
Additional Information
Only candidates who are shortlisted will be contacted with further details.